Carrier film for semi-conductor wafer processing

A carrier film, comprising:

• an adhesive layer comprising 50% to 100% by weight of a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C. and 0% to 50% by weight of a first polyolefin elastomer, wherein a thickness of the adhesive layer is between about 1 μm and about 20 μm;
• a core layer comprising a second polyolefin elastomer, wherein a thickness of the core layer is between about 40 μm and about 80 μm;
• and
• a release layer comprising a polyolefin, wherein a thickness of the release layer is between about 1 μm and about 20 μm,
• wherein the thickness of the core layer is greater than a sum of the thickness of the adhesive layer and the thickness of the release layer,
• wherein the thickness of the core layer is at least 75% of a sum of the thickness of the adhesive layer, the thickness of the release layer, and the thickness of the core layer,
• wherein the hydrogenated styrene block copolymer in the adhesive layer has a melt flow rate (MFR) of between about 10 g/10 minutes and about 300 g/10 minutes at 230° C. under a 2.16 kg mass, and
• wherein the first polyolefin elastomer in the adhesive layer has a melt flow rate of between 1 g/10 minutes and about 100 g/10 minutes at 190° C. under a 2.16 kg mass.