C08K 5/3155
Dicyandiamide
Official title: {Dicyandiamide}
C08K5/3155 (Dicyandiamide) appears on 33 US grants and 63 published applications in this corpus.
Search patents in C08K- Granted patents
- 33
- Published applications
- 63
- Assignees
- 54
- Inventors
- 203
- Latest grant
- 16 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 0 | 4 |
| 2011 | 1 | 2 |
| 2012 | 1 | 3 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 2 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 3 |
| 2020 | 1 | 9 |
| 2021 | 1 | 3 |
| 2022 | 4 | 4 |
| 2023 | 1 | 3 |
| 2024 | 3 | 6 |
| 2025 | 5 | 12 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Non-aqueous sprayable and curable dampening compositions for automotive body and closure panels and associated methods for curing and using the same16 Sep 2025US 12,415,933 B2Uniseal, Inc.
- Sheet molding compound and fiber-reinforced composite material15 Apr 2025US 12,275,838 B2Mitsubishi Chemical Corporation
- Structural adhesive tape and method of manufacturing the same8 Apr 2025US 12,269,974 B2Hyundai Motor Company
- Packaging film and preparation method thereof, and filter chip packaging method18 Mar 2025US 12,252,613 B1Wuhan Choice Technology Co,Ltd
- Surface veil and surface film integrated prepreg layer and processes for making the same21 Jan 2025US 12,202,241 B2Kordsa Teknik Tekstil A.S.
- Epoxy resin composition, varnish, inorganic composite sheet, and metal-based substrate17 Sep 2026US 2026/0275152 A1DIC Corporation
- One-component expandable thermosetting epoxy composition with reduced voc emission30 Jul 2026US 2026/0217319 A1Sika Technology AG
- Expandable epoxy compositions for low temperature curing and structural adhesive therefrom, and methods of using same9 Jul 2026US 2026/0193491 A1Henkel AG & Co. KGaA
- Non-aqueous sprayable and curable dampening compositions for automotive body and closure panels and associated methods for curing and using the same25 Sep 2025US 2025/0297125 A1
- A method for the preparation of an epoxy resin composition for the pre-impregnation of materials14 Aug 2025US 2025/0257194 A1Alzchem Trostberg GmbH
Most cited
By later US patents
- Flexible polyurethane foam having a high fire resistance59US 4,895,878 ARecticel · 1990
- Adhesive sheet and bonding method using the same15US 9,512,335 B2Dai Nippon Printing Co.Ltd. · 2016
- Resin composition14US 6,147,146 AAsahi Kasei Kogyo Kabushiki Kaisha · 2000
- Dispersion polymer polyols11US 5,118,721 APolyol International B. V. · 1992
- Glass fiber wool binder10US 4,095,010 AOwens-Corning Fiberglas Corporation · 1978