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US 2026/0193491 A1Published application
Expandable epoxy compositions for low temperature curing and structural adhesive therefrom, and methods of using same
AssigneeHenkel AG & Co. KGaA
InventorsYuan Zhao, Jinfeng Zhong, Qi Chen, Xuewen Zhang
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Abstract
This invention relates to an expandable epoxy composition comprising at least one epoxy resin, a toughening agent, an accelerant, a foaming agent, a curing agent, which can be cured and foamed at low temperature, e.g., 120° C., along with related methods of making and using the same, for structural adhesives after curing and foaming, for example, in automotive industrial bonding applications, which provides particularly good impact peel strength, good storage ability and the expandable epoxy compositions could be cured/foamed at low temperature.
Claims23
An expandable epoxy composition, comprising:
- a) at least one epoxy resin,
- b) a toughening agent, a
- c) an accelerant,
- d) a foaming agent, and
- e) a curing agent,
- wherein the expandable epoxy composition has a T peel strength pursuant to ASTM D1876 at 23° C. of equal to or greater than 6 N/mm, a shear strength pursuant to SAE J1523 at 23° C. of equal to or greater than 6 MPa, and an expanding rate % of equal to or greater than 50%, after curing and foaming the expandable epoxy composition at 140° C. for 15 minutes.
3 more elements
Dependencies are inferred from the claim text.