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US 12,275,838 B2Granted
Sheet molding compound and fiber-reinforced composite material
AssigneeMitsubishi Chemical Corporation
InventorsAkira Ota, Masahiro Ichino, Takuya Teranishi
Life of this patent
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Abstract
A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.
Claims18
A process for manufacturing a sheet molding compound, comprising:
- impregnating a sheet-like substance formed of chopped reinforcing fiber tows with an epoxy resin composition;
- and
- thickening the epoxy resin composition so that the epoxy resin composition shifts to a B-stage,
- wherein the epoxy resin composition comprises
- a component (A),
- a component (B) and
- a component (C),
- wherein
- the component (A) is an epoxy resin staying in a liquid state at 25° C. and comprises a glycidyl amine-based epoxy resin,
- the component (B) is an acid anhydride,
- the component (C) is an epoxy resin curing agent comprising an imidazole-based compound having a melting point of 120° C. to 300° C.,
- wherein the epoxy resin composition is free of a urea compound,
- wherein a glass transition temperature of a cured material obtainable by curing the epoxy resin composition at 140° C. for 10 minutes is 140° C. to 163° C., and
- wherein a content of the component (C) with respect to 100 parts by mass of the entire epoxy resin contained in the epoxy resin composition is 2 to 10 parts by mass.
11 more elements
Dependencies are inferred from the claim text.