C08K 2003/382
And nitrogen
Official title: {and nitrogen}
C08K2003/382 (And nitrogen) appears on 419 US grants and 846 published applications in this corpus.
Search patents in C08K- Granted patents
- 419
- Published applications
- 846
- Assignees
- 383
- Inventors
- 1,939
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 2 | 4 |
| 2004 | 2 | 2 |
| 2005 | 1 | 4 |
| 2006 | 1 | 3 |
| 2007 | 0 | 1 |
| 2008 | 1 | 2 |
| 2009 | 1 | 1 |
| 2010 | 5 | 4 |
| 2011 | 0 | 4 |
| 2012 | 2 | 5 |
| 2013 | 4 | 7 |
| 2014 | 5 | 23 |
| 2015 | 11 | 41 |
| 2016 | 17 | 52 |
| 2017 | 26 | 43 |
| 2018 | 24 | 58 |
| 2019 | 28 | 62 |
| 2020 | 39 | 88 |
| 2021 | 34 | 84 |
| 2022 | 35 | 90 |
| 2023 | 65 | 85 |
| 2024 | 37 | 74 |
| 2025 | 42 | 63 |
| 2026 | 29 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Credential handling of an IoT safe applet6 Oct 2026US 12,757,025 B2Telefonaktiebolaget LM Ericsson (publ)
- Thermally conductive silicone grease composition and method for producing the same11 Aug 2026US 12,703,818 B2Fuji Polymer Industries Co., Ltd.
- Two-layer dielectric coating11 Aug 2026US 12,706,311 B2PPG Industries Ohio, Inc.
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board4 Aug 2026US 12,698,393 B2Panasonic Intellectual Property Management Co., Ltd.
- Direct write dual cure gasket4 Aug 2026US 12,698,410 B2Raytheon Company
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Thermally conductive sheet and aggregated boron nitride particles17 Sep 2026US 2026/0275073 A1Denka Company Limited
- Hexagonal boron nitride powder, resin composition, and resin sheet10 Sep 2026US 2026/0265056 A1Tokuyama Corporation
- Compositions containing thermally conductive fillers3 Sep 2026US 2026/0258279 A1PPG Industries Ohio, Inc.
- Boron nitride particles, resin composition, and uses therefor20 Aug 2026US 2026/0242221 A1Resonac Corporation
Most cited
By later US patents
- Thermally conductive thermoplastic70US 6,162,849 AFerro Corporation · 2000
- Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics39US 8,946,333 B2Momentive Performance Materials Inc. · 2015
- High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them38US 6,645,612 B2Saint-Gobain Ceramics & Plastics, Inc. · 2003
- High speed extrusion30US 5,688,457 AE. I. Du Pont de Nemours and Company · 1997
- Molding material27US 10,189,972 B2The Gillette Company · 2019