Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

A resin composition, comprising:

• a polyphenylene ether compound having at least one of groups expressed by the following formulas (1) and (2);
• a curing agent reactable with the polyphenylene ether compound;
• a styrene-based polymer having structural units expressed by the following formulas (3) and (4);
• and
• an inorganic filler containing boron nitride,
• wherein
• the styrene-based polymer includes a styrene-isobutylene-styrene block copolymer;
• a content of the inorganic filler is 100 to 320 parts by mass relative to 100 parts by mass of a total of the polyphenylene ether compound, the curing agent, and the styrene-based polymer;
• and
• wherein a cured product of the resin composition has a dielectric loss tangent at a frequency of 10 GHz of 0.0032 or less,
• wherein in formula (1), s denotes an integer of 0 to 10, Z represents an arylene group, and R1 to R3 each independently represents a hydrogen atom or an alkyl group;
• wherein in formula (2), R4 represents a hydrogen atom or an alkyl group;
• wherein in formula (3), R35 to R37 each independently represents a hydrogen atom or an alkyl group, and R38 represents a hydrogen atom or an alkyl group;
• and
• wherein in formula (4),
• R39 to R42 each independently represents a hydrogen atom or an alkyl group, and
• when R39 and R40 each independently represents an alkyl group, R41 and R42 each represents a hydrogen atom, and alternatively, when R41 and R42 each independently represents an alkyl group, R39 and R40 each represents a hydrogen atom.