C08J 2425/16
Homopolymers or copolymers of alkyl-substituted styrenes
C08J2425/16 (Homopolymers or copolymers of alkyl-substituted styrenes) appears on 5 US grants and 13 published applications in this corpus.
Search patents in C08J- Granted patents
- 5
- Published applications
- 13
- Assignees
- 12
- Inventors
- 45
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 2 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 2 |
| 2025 | 0 | 4 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Resin composition, insulating resin film and use thereof1 Sep 2026US 12,723,137 B2Shengyi Technology Co., Ltd.
- Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition20 Feb 2024US 11,905,409 B2Panasonic Intellectual Property Management Co., Ltd.
- Photonic crystal structure and anti-forgery color conversion film comprising same20 Dec 2022US 11,531,150 B2Korea Research Institute of Chemical Technology
- Thermoplastic resin composition, method of preparing the same, and molded part including the same5 May 2020US 10,640,638 B2LG Chem.Ltd.
- Polyolefin interpenetrated network material for hydrocarbon recovery9 Jan 2018US 9,861,954 B2The Penn State Research Foundation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package24 Sep 2026US 2026/0286077 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package23 Oct 2025US 2025/0326929 A1Resonac Corporation
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device12 Jun 2025US 2025/0188256 A1Mitsubishi Gas Chemical Company, Inc.
- Resin composition and article made therefrom12 Jun 2025US 2025/0188262 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Hollow particles20 Feb 2025US 2025/0059339 A1Zeon Corporation
Most cited
By later US patents