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US 11,905,409 B2Granted
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKosuke Tsuda, Hirosuke Saito, Yiqun Wang, Hiroharu Inoue
Life of this patent
Estimating the term…
Abstract
An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
Claims16
A resin composition comprising:
- a polyphenylene ether compound having at least one of groups represented by the following Formulas (1) and (2);
- and
- an allyl compound represented by the following Formula (3):
- (in Formula (1), p represents an integer 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group)
- (in Formula (2), R4 represents a hydrogen atom or an alkyl group)
- (in Formula (3), RA represents an alkyl or alkenyl group having 8 to 22 carbon atoms).
3 more elements
Dependencies are inferred from the claim text.