Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsJun DU, Rongtao WANG, Xueyan JIANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsJun DU, Rongtao WANG, Xueyan JIANG
Estimating the term…
A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (B) 1 part by weight to 15 parts by weight of a compound of Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, storage modulus decay rate, reflow warpage magnitude, percent of thermal expansion in Z-axis, dissipation factor and laminate appearance.
A resin composition, comprising:
Dependencies are inferred from the claim text.