C08G 59/226
Mixtures of di-epoxy compounds
Official title: {Mixtures of di-epoxy compounds}
C08G59/226 (Mixtures of di-epoxy compounds) appears on 456 US grants and 391 published applications in this corpus.
Search patents in C08G- Granted patents
- 456
- Published applications
- 391
- Assignees
- 258
- Inventors
- 1,279
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 6 | 0 |
| 1978 | 13 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 8 | 0 |
| 1982 | 9 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 7 | 0 |
| 1986 | 15 | 0 |
| 1987 | 5 | 0 |
| 1988 | 12 | 0 |
| 1989 | 19 | 0 |
| 1990 | 10 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 13 | 0 |
| 1994 | 15 | 0 |
| 1995 | 5 | 0 |
| 1996 | 16 | 0 |
| 1997 | 10 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 4 |
| 2002 | 2 | 3 |
| 2003 | 7 | 7 |
| 2004 | 4 | 8 |
| 2005 | 2 | 2 |
| 2006 | 4 | 10 |
| 2007 | 1 | 11 |
| 2008 | 0 | 5 |
| 2009 | 6 | 11 |
| 2010 | 6 | 21 |
| 2011 | 6 | 13 |
| 2012 | 7 | 19 |
| 2013 | 15 | 13 |
| 2014 | 15 | 10 |
| 2015 | 11 | 24 |
| 2016 | 7 | 11 |
| 2017 | 7 | 22 |
| 2018 | 15 | 17 |
| 2019 | 23 | 19 |
| 2020 | 13 | 28 |
| 2021 | 18 | 28 |
| 2022 | 15 | 22 |
| 2023 | 15 | 15 |
| 2024 | 10 | 22 |
| 2025 | 16 | 31 |
| 2026 | 7 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High-performance composite panel and manufacturing method8 Sep 2026US 12,729,277 B2The United States of America as represented by the Secretary of the Army
- Binder composition, epoxy-based cured product formed therefrom, and light emitting layer containing epoxy-based cured product30 Jun 2026US 12,668,658 B2Hyundai Motor Company
- Epoxy resin composition, prepreg, and fiber-reinforced composite material19 May 2026US 12,630,708 B2Toray Industries, Inc.
- Curable adhesive, bonding film, and method of bonding the same7 Apr 2026US 12,595,333 B23M Innovative Properties Company
- Stereolithographic resin composition and three-dimensional shaped object7 Apr 2026US 12,595,355 B2Canon Kabushiki Kaisha
- Implantable medical devices with photocurable feedthrough potting adhesives and methods of manufacture17 Sep 2026US 2026/0273289 A1
- One component composition based on epoxy resins10 Sep 2026US 2026/0265592 A1Henkel AG & Co. KGaA
- Method for curing a cationically polymerizable epoxy resin composition20 Aug 2026US 2026/0242644 A1Henkel AG & Co. KGaA
- Resin composition, film, film set, optical waveguide, opto-electric composite substrate, and electronic component30 Jul 2026US 2026/0218020 A1Sumitomo Bakelite Co., Ltd.
- Epoxy Resin Composition9 Jul 2026US 2026/0193406 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Flexible poly(amino ethers) for barrier packaging158US 5,464,924 AThe Dow Chemical Company · 1995
- Hardenable resin compositions and methods88US 5,232,961 A1993
- Stable aqueous epoxy dispersions79US 4,315,044 ACelanese Corporation · 1982
- Epoxy resin composition with cycloaliphatic epoxy-functional siloxane66US 5,863,970 AMotorola, Inc. · 1999
- High performance induction curable two-component structural adhesive with nonsagging behavior51US 4,762,864 AAshland Oil, Inc. · 1988