C08G 59/188
Using encapsulated compounds
Official title: {using encapsulated compounds}
C08G59/188 (Using encapsulated compounds) appears on 67 US grants and 74 published applications in this corpus.
Search patents in C08G- Granted patents
- 67
- Published applications
- 74
- Assignees
- 59
- Inventors
- 195
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 3 |
| 2003 | 2 | 3 |
| 2004 | 2 | 5 |
| 2005 | 2 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 3 |
| 2010 | 2 | 2 |
| 2011 | 4 | 1 |
| 2012 | 1 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 1 | 2 |
| 2016 | 1 | 5 |
| 2017 | 3 | 10 |
| 2018 | 5 | 3 |
| 2019 | 8 | 5 |
| 2020 | 2 | 6 |
| 2021 | 5 | 7 |
| 2022 | 6 | 4 |
| 2023 | 4 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable compositions12 May 2026US 12,624,152 B2PPG Industries Ohio, Inc.
- Silicone-based protective formulations5 Sep 2023US 11,746,243 B2Autonomic Materials, Inc.
- Low-temperature heat-curable adhesive composition for structure20 Jun 2023US 11,680,193 B2Cemedine Co., Ltd.
- Structure adhesive composition exhibiting favorable thread breakage and capable of stitch coating4 Apr 2023US 11,618,839 B2Cemedine Co., Ltd.
- Environmentally biodegradable microcapsules10 Jan 2023US 11,547,978 B2Trucapsol LLC
- Epoxy resin composition, encapsulant, semiconductor encapsulant, adhesive, camera module, semiconductor package, and electronic equipment17 Sep 2026US 2026/0275174 A1Asahi Kasei Kabushiki Kaisha
- Thermal-and-uv-curable (meth)acrylate composition21 May 2026US 2026/0139157 A1Henkel AG & Co. KGaA
- Polyoxazoline based thermal latent curing agents for thermoset resins15 Aug 2024US 2024/0270940 A1Sabanci Universitesi
- Curable compositions24 Nov 2022US 2022/0372207 A1PPG Industries Ohio, Inc.
- Adherable element with pressure-activated adhesive system6 Oct 2022US 2022/0315812 A1
Most cited
By later US patents
- Ambient-temperature-stable, one-part curable epoxy adhesive44US 6,506,494 B23M Innovative Properties Company · 2003
- Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent24US 4,808,639 AProduction Previews, Inc. · 1989
- Pressure sensitive adhesive composition20US 4,940,852 A1990
- Liquid crystal electro-optical element and process for preparation thereof20US 4,989,955 ASeiko Instruments & Electronics Ltd. · 1991
- Releasable microcapsule and adhesive curing system using the same20US 6,936,644 B2Cookson Electronics, Inc. · 2005