Low-temperature heat-curable adhesive composition for structure

Abstract

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Dependencies are inferred from the claim text.