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US 2026/0275174 A1Published application
Epoxy resin composition, encapsulant, semiconductor encapsulant, adhesive, camera module, semiconductor package, and electronic equipment
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsTakuya MIZUGUCHI, Naoya KAMIMURA, Ryosuke OKAMOTO, Masatoshi OTONARI
Life of this patent
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Abstract
Provided is an epoxy resin composition comprising an epoxy resin (A) and a curing agent (B), wherein in the curing agent (B), when a value of a total amine value is defined as (a) and a value of a tertiary amine value is defined as (b), the values of (a) and (b) satisfy the following relational expression (1): ( a ) - ( b ) ≥ 5 . 0 . ( 1 )
Claims25
An epoxy resin composition comprising an epoxy resin (A) and a curing agent (B), wherein
- in the curing agent (B),
- when a value of a total amine value is defined as (a) and a value of a tertiary amine value is defined as (b), the values of (a) and (b) satisfy the following relational expression (1):
- (
- a
- )
- -
- (
- b
- )
- ≥
- 5.
- .
- (
- 1
- )
12 more elements
An epoxy resin composition comprising an epoxy resin (A) and a curing agent particle (B-1), wherein
- in the curing agent particle (B-1),
- when a value of a total amine value is defined as (a) and a value of a tertiary amine value is defined as (b), the values of (a) and (b) satisfy the following relational expression (1):
- (
- a
- )
- -
- (
- b
- )
- ≥
- 5.
- ,
- (
- 1
- )
- the curing agent particle (B-1) comprises
- at least one or more reaction products of an epoxy resin (C) and an alicyclic amine compound (D), and
- a light transmittance measured at a wavelength of 365 nm by ultraviolet-visible spectroscopy of the curing agent particle (B-1) in the form of a solution of 1.0% by mass in dimethylformamide (DMF) is 50.0% or more.
15 more elements
Dependencies are inferred from the claim text.