C08F 283/045
On to unsaturated polycarbonamides, polyesteramides or polyimides
Official title: {on to unsaturated polycarbonamides, polyesteramides or polyimides}
C08F283/045 (On to unsaturated polycarbonamides, polyesteramides or polyimides) appears on 17 US grants and 27 published applications in this corpus.
Search patents in C08F- Granted patents
- 17
- Published applications
- 27
- Assignees
- 25
- Inventors
- 70
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 4 |
| 2015 | 3 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 2 | 1 |
| 2020 | 0 | 0 |
| 2021 | 2 | 4 |
| 2022 | 0 | 3 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 2 | 3 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Poly(amide-imide) copolymer, composition and polymer film comprising thereof2 Sep 2025US 12,404,371 B2LG Chem.Ltd.
- Curable resin composition, dry film and cured product thereof, and electronic component including cured product6 May 2025US 12,291,604 B2Taiyo Holdings Co., Ltd.
- Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure24 Sep 2024US 12,098,230 B2Wuhan Choice Technology Co,Ltd
- Electrolyte for lithium secondary battery14 Nov 2023US 11,817,557 B2LG Energy Solution, Ltd.
- Liquid crystal display device7 Sep 2021US 11,112,654 B2Nissan Chemical Industries, Ltd.
- Compositions for forming polyimide coatings13 Aug 2026US 2026/0234438 A1Hd Microsystems, Ltd.
- Resin composition, cured product of resin composition, semiconductor device, and electronic component26 Feb 2026US 2026/0055225 A1Namics Corporation
- Polymer film-forming composition and selective polymer film-forming method3 Jul 2025US 2025/0215256 A1Nissan Chemical Corporation
- Resin composition and article made therefrom1 May 2025US 2025/0136739 A1Elite Material Co., Ltd.
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device20 Feb 2025US 2025/0059347 A1FUJIFILM Corporation
Most cited
By later US patents
- Radiation-polymerizable composition and printing inks containing same43US 6,239,189 B1Henkel Corporation · 2001
- Hybrid polymer materials for liquid crystal alignment layers7US 6,919,404 B2Elsicon, Inc. · 2005
- Composition for forming substrate, and prepreg and substrate using the same4US 8,105,663 B2Samsung Electro-Mechanics Co., Ltd. · 2012
- Aqueous dispersion of cationic fine grain gel and process for preparing the same3US 6,011,103 AArakawa Kagaku Kogyo Kabushiki Kaisha · 2000
- Solventless radiation curable stretchable ink composition1US 8,933,148 B2Xerox Corporation · 2015