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US 2025/0136739 A1Published application
Resin composition and article made therefrom
AssigneeElite Material Co., Ltd.
InventorChen-Yu HSIEH
Life of this patent
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Abstract
A resin composition includes a polymer, which has a first structural unit of Formula (1) and a second structural unit of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength and warpage at high temperature.
Claims10
A resin composition, comprising a polymer which has a first structural unit of Formula (1) and a second structural unit of Formula (2):
- wherein Ar are the same or different and independently represent a divalent organic group;
- R1 are the same or different and independently represent a methyl group or a trifluoromethyl group;
- m1 are the same or different and independently represent an integer of 6 to 8;
- m2 are the same or different and independently represent an integer of 5 to 8;
- and n/m is between 1 and 3, such that the polymer has a weight average molecular weight of between 30,000 and 70,000.
2 more elements
Dependencies are inferred from the claim text.