C03B 33/074
Glass products comprising an outer layer or surface coating of non-glass material
Official title: {Glass products comprising an outer layer or surface coating of non-glass material}
C03B33/074 (Glass products comprising an outer layer or surface coating of non-glass material) appears on 81 US grants and 120 published applications in this corpus.
Search patents in C03B- Granted patents
- 81
- Published applications
- 120
- Assignees
- 55
- Inventors
- 285
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 5 |
| 2005 | 0 | 3 |
| 2006 | 4 | 4 |
| 2007 | 2 | 0 |
| 2008 | 1 | 3 |
| 2009 | 1 | 5 |
| 2010 | 4 | 3 |
| 2011 | 3 | 2 |
| 2012 | 3 | 4 |
| 2013 | 5 | 9 |
| 2014 | 5 | 6 |
| 2015 | 2 | 8 |
| 2016 | 5 | 8 |
| 2017 | 4 | 6 |
| 2018 | 3 | 4 |
| 2019 | 5 | 7 |
| 2020 | 2 | 4 |
| 2021 | 6 | 11 |
| 2022 | 3 | 11 |
| 2023 | 3 | 4 |
| 2024 | 7 | 6 |
| 2025 | 4 | 4 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Unit cell thin film glass manufactured by means of glass cutting and post-processing method22 Sep 2026US 12,741,897 B2Dowooinsys Co., Ltd.
- Glass substrate heat chamfering method and apparatus10 Feb 2026US 12,545,616 B2Corning Incorporated
- Method for ablating coating film, cutting glass, and performing post-treatment by using laser20 Jan 2026US 12,528,730 B2Dowooinsys Co., Ltd.
- Methods for adjusting beam properties for laser processing coated substrates23 Sep 2025US 12,421,155 B2Corning Incorporated
- Method for dividing composite material24 Jun 2025US 12,338,160 B2Nitto Denko Corporation
- Method for manufacturing glass panel unit, and glass panel unit assembly6 Nov 2025US 2025/0340039 A1Panasonic Intellectual Property Management Co., Ltd.
- Unit cell thin film glass manufactured by means of glass cutting and post-processing method15 May 2025US 2025/0154046 A1Dowooinsys Co., Ltd.
- Packaging substrate and manufacturing method of the same27 Mar 2025US 2025/0105072 A1Absolics Inc.
- Brittle material chip, brittle material sheet, method for producing brittle material sheet, and method for producing brittle material chip30 Jan 2025US 2025/0034023 A1Nitto Denko Corporation
- Method for manufacturing transparent member, transparent member, and window component for optical element12 Dec 2024US 2024/0409457 A1Nippon Electric Glass Co., Ltd.
Most cited
By later US patents
- Method for breaking a glass sheet130US 5,622,540 ACorning Incorporated · 1997
- Method of cutting processed object104US 7,749,867 B2Hamamatsu Photonics K.K. · 2010
- Laser processing method98US 7,939,430 B2Hamamatsu Photonics K.K. · 2011
- Laser scribe and break process46US 5,961,852 AOptical Coating Laboratory, Inc. · 1999
- Method of cutting an object to be processed23US 8,183,131 B2Hamamatsu Photonics K.K. · 2012