Method of cutting an object to be processed

A method of manufacturing a semiconductor device formed using a method of cutting an object to be processed, the manufacturing method comprising:

• a starting point region for cutting forming step of irradiating a wafer-like object to be processed with laser light, the object comprising semiconductor material and having a surface formed with at least one semiconductor device, while positioning a light-converging point therewithin, so as to form a modified region due to multiphoton absorption within the object, with the modified region forming a starting point region serving as a starting point for cutting, deviated from a center position of the object in a thickness direction thereof toward one end face of the object, the object along a line along which the object is to be cut;
• and
• a pressing step of pressing the object from the other end face side of the object, with such pressing thereby resulting in cutting the object along the line along which the object is to be cut in order to provide at least one manufactured semiconductor device.