Packaging substrate and manufacturing method of the same
AssigneeAbsolics Inc.
InventorsTae Kyoung KIM, Chun Jae LEE, Sungjin KIM
Life of this patent
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Abstract
An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.
Claims12
A packaging substrate, comprising
- a glass core comprising first surface and second surface facing each other;
- and
- an upper layer stacked on the first surface, or a lower layer stacked on the second surface,
- wherein a corner of the packaging substrate is a curved or chamfered.
A manufacturing method of a packaging substrate, comprising
- a forming operation of an upper layer on a first surface or a lower layer on a second surface wherein the first surface and the second surface is comprised in a glass core and facing each other;
- a forming operation of a cut portion on any one from the group of the upper layer, the first surface, the lower layer, the second surface and a combination thereof along a predetermined cutting line;
- a cutting operation of the glass core along the cut portion to expose a cut surface;
- and
- a grinding operation of the cut surface.
Dependencies are inferred from the claim text.