B65H 2701/361
Semiconductor bonding wires
B65H2701/361 (Semiconductor bonding wires) appears on 5 US grants and 14 published applications in this corpus.
Search patents in B65H- Granted patents
- 5
- Published applications
- 14
- Assignees
- 12
- Inventors
- 27
- Latest grant
- 11 Jul 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 3 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 2 |
| 2025 | 0 | 1 |
| 2026 | 0 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Wound body of sheet for sintering bonding with base material11 Jul 2023US 11,697,567 B2Nitto Denko Corporation
- Wire spool system for a wire bonding apparatus4 Oct 2016US 9,461,013 B2Asm Technology Singapore Pte Ltd
- Spool case for bonding wire, and method of handling spool using same15 Mar 2005US 6,866,148 B2W. C. Heraeus GmbH
- Spool holder structure for a wire bonder27 Aug 2002US 6,439,496 B2Kabushiki Kaisha Shinkawa
- Spool case of bonding wire5 Jun 2001US 6,241,094 B1Tanaka Denshi Kogyo K. K.
- Pneumatic wire threading device and method27 Aug 2026US 2026/0249381 A1Asmpt Singapore Pte. Ltd.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Wire buffer system13 Aug 2026US 2026/0233962 A1GM Global Technology Operations LLC
- Wire feeder5 Mar 2026US 2026/0062249 A1Samsung Electronics Co., Ltd.
- Wire supply module and wire bonding machine including the same27 Feb 2025US 2025/0066154 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents