Wound body of sheet for sintering bonding with base material
AssigneeNitto Denko Corporation
InventorsRyota Mita, Tomoaki Ichikawa
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Abstract
To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.
Claims8
A wound body having a form in which
- a sheet for sintering bonding with a base material is wound around a winding core into a roll,
- the sheet for sintering bonding with a base material having a laminated structure comprising:
- a base material;
- and
- a sheet for sintering bonding, comprising:
- an electrically conductive metal containing sinterable particle;
- and
- a binder component,
- wherein an outer diameter of the winding core and a thickness of the sheet for sintering bonding satisfy the following formula:
- [the outer diameter of the winding core (mm)]/[the thickness of the sheet for sintering bonding (mm)]2≥3500.
Dependencies are inferred from the claim text.