B41J 2002/14346
Ejection by pressure produced by thermal deformation of ink chamber
Official title: {Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling}
B41J2002/14346 (Ejection by pressure produced by thermal deformation of ink chamber) appears on 331 US grants and 308 published applications in this corpus.
Search patents in B41J- Granted patents
- 331
- Published applications
- 308
- Assignees
- 33
- Inventors
- 78
- Latest grant
- 15 Aug 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 17 | 7 |
| 2002 | 18 | 6 |
| 2003 | 10 | 15 |
| 2004 | 15 | 36 |
| 2005 | 23 | 73 |
| 2006 | 43 | 27 |
| 2007 | 35 | 27 |
| 2008 | 42 | 31 |
| 2009 | 26 | 36 |
| 2010 | 36 | 26 |
| 2011 | 38 | 7 |
| 2012 | 4 | 10 |
| 2013 | 5 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 1 |
| 2019 | 2 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 1 |
| 2023 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wafer structure15 Aug 2023US 11,724,499 B2Microjet Technology Co., Ltd.
- Liquid ejection head including a plurality of recording element substrates formed adjacent to each other to form an array such that a gap in temperature distribution is prevented7 Mar 2023US 11,597,203 B2Canon Kabushiki Kaisha
- Methods of forming and using fluid ejection devices and printheads10 Aug 2021US 11,084,283 B2STMicroelectronics S.r. l.
- Fluid ejection device and printhead3 Dec 2019US 10,493,758 B2STMicroelectronics S.r. l.
- Liquid ejecting apparatus26 Mar 2019US 10,239,315 B2Seiko Epson Corporation
- Wafer structure14 Jul 2022US 2022/0219454 A1Microjet Technology Co., Ltd.
- Liquid ejection head and liquid ejection apparatus30 Dec 2021US 2021/0402765 A1Canon Kabushiki Kaisha
- Fluid ejection device and printhead5 Mar 2020US 2020/0070511 A1STMicroelectronics S.r. l.
- Fluid ejection device, printhead, printer, and method for manufacturing the ejection device4 Oct 2018US 2018/0281402 A1STMicroelectronics S.r. l.
- Liquid ejecting apparatus30 Nov 2017US 2017/0341395 A1Seiko Epson Corporation
Most cited
By later US patents
- Ink jet head and a method of manufacturing thereof420US 5,666,141 ASharp Kabushiki Kaisha · 1997
- Diaphragm type ink jet head having a high degree of integration and a high ink discharge efficiency373US 5,719,604 ASharp Kabushiki Kaisha · 1998
- Method of manufacture of a thermally actuated ink jet including a tapered heater element166US 6,180,427 B2Silverbrook Research Pty Ltd · 2001
- Surface bend actuator vented ink supply ink jet printing mechanism146US 6,260,953 B1Silverbrook Research Pty Ltd · 2001
- Ink jet head compact and allowing ink to be discharged with great force by using deformable structure145US 5,825,383 ASharp Kabushiki Kaisha · 1998