B41J 2/1625
Electroforming
Official title: {electroforming}
B41J2/1625 (Electroforming) appears on 249 US grants and 161 published applications in this corpus.
Search patents in B41J- Granted patents
- 249
- Published applications
- 161
- Assignees
- 55
- Inventors
- 435
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 15 | 4 |
| 2002 | 13 | 12 |
| 2003 | 12 | 7 |
| 2004 | 8 | 13 |
| 2005 | 11 | 16 |
| 2006 | 9 | 17 |
| 2007 | 7 | 14 |
| 2008 | 4 | 10 |
| 2009 | 6 | 14 |
| 2010 | 9 | 5 |
| 2011 | 12 | 5 |
| 2012 | 4 | 3 |
| 2013 | 6 | 4 |
| 2014 | 5 | 6 |
| 2015 | 8 | 2 |
| 2016 | 1 | 4 |
| 2017 | 5 | 2 |
| 2018 | 3 | 4 |
| 2019 | 5 | 2 |
| 2020 | 3 | 2 |
| 2021 | 0 | 2 |
| 2022 | 2 | 2 |
| 2023 | 2 | 3 |
| 2024 | 2 | 5 |
| 2025 | 1 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid ejection head11 Aug 2026US 12,703,182 B2RISO Technologies Corporation
- Liquid ejecting head and liquid ejecting apparatus17 Mar 2026US 12,576,639 B2RISO Technologies Corporation
- Photodefined aperture plate and method for producing the same3 Mar 2026US 12,565,710 B2Stamford Devices Limited
- Reducing size variations in funnel nozzles9 Sep 2025US 12,409,655 B2FUJIFILM Dimatix, Inc.
- Molded structures with channels5 Nov 2024US 12,134,274 B2Hewlett-Packard Development Company, L. P.
- Photodefined aperture plate and method for producing the same18 Jun 2026US 2026/0168127 A1Stamford Devices Limited
- Electroforming plate, method of manufacturing electroforming plate, metal molded article manufacturing method14 Aug 2025US 2025/0257493 A1FUJIFILM Corporation
- Liquid ejection head13 Mar 2025US 2025/0083440 A1RISO Technologies Corporation
- Liquid Ejecting Head And Liquid Ejecting Apparatus26 Dec 2024US 2024/0425726 A1Seiko Epson Corporation
- Photodefined aperture plate and method for producing the same17 Oct 2024US 2024/0344226 A1Stamford Devices Limited
Most cited
By later US patents
- Liquid jet recording head1,616US 4,558,333 ACanon Kabushiki Kaisha · 1985
- Corrugated MEMS heater structure225US 6,087,638 ASilverbrook Research Pty Ltd · 2000
- Ink jet printhead and method of making224US 5,790,151 Aimaging Technology international Corp. · 1998
- Thermal jet recording apparatus213US 4,914,562 ASeiko Epson Corporation · 1990
- Large expandable array thermal ink jet pen and method of manufacturing same196US 5,016,023 AHewlett-Packard Company · 1991