Molded structures with channels
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Michael G. Groh
Life of this patent
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Abstract
An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
Claims16
A device comprising:
- a molded structure comprising:
- thermo-electric traces;
- and
- first channels;
- a dependent device coupled to the molded structure, the dependent device comprising:
- thermo-electric contacts connected to the thermo-electric traces;
- and
- apertures,
- wherein a cooling fluid travels through the first channels of the molded structure and into the apertures of the dependent device to extract thermal energy from the dependent device and carry the extracted thermal energy away from the dependent device through the apertures and the first channels, wherein the dependent device further comprises second channels, wherein the second channels are microfluidic channels through which the cooling fluid travels to carry the thermal energy away from the dependent device.
A device comprising:
- a molded structure comprising:
- thermo-electric traces;
- and
- channels;
- a fluidic die of a fluid ejection device, the fluidic die comprising;
- an array of fluid ejection nozzles through which droplets of printing fluid are ejected towards a substrate coupled to the molded structure:
- thermo-electric contacts connected to the thermo-electric traces;
- and
- apertures;
- wherein a cooling fluid travels through the channels of the molded structure and into the apertures of the dependent device to extract thermal energy from the dependent device and carry the extracted thermal energy away from the dependent device through the apertures and the channels, wherein the dependent device further comprises second channels, wherein the second channels are microfluidic channels through which the cooling fluid travels to carry the thermal energy away from the dependent device;
- and
- wherein the thermo-electric contacts are configured to enable dissipation of the thermal energy via the thermo-electric traces.
Dependencies are inferred from the claim text.