B32B 37/0015
To avoid warp or curl
Official title: {to avoid warp or curl}
B32B37/0015 (To avoid warp or curl) appears on 146 US grants and 193 published applications in this corpus.
Search patents in B32B- Granted patents
- 146
- Published applications
- 193
- Assignees
- 152
- Inventors
- 440
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 3 |
| 2002 | 3 | 7 |
| 2003 | 5 | 10 |
| 2004 | 4 | 3 |
| 2005 | 4 | 5 |
| 2006 | 8 | 12 |
| 2007 | 2 | 6 |
| 2008 | 0 | 7 |
| 2009 | 3 | 2 |
| 2010 | 6 | 6 |
| 2011 | 3 | 17 |
| 2012 | 4 | 7 |
| 2013 | 4 | 7 |
| 2014 | 3 | 5 |
| 2015 | 2 | 14 |
| 2016 | 9 | 13 |
| 2017 | 12 | 10 |
| 2018 | 7 | 13 |
| 2019 | 8 | 9 |
| 2020 | 12 | 6 |
| 2021 | 7 | 9 |
| 2022 | 8 | 7 |
| 2023 | 5 | 7 |
| 2024 | 5 | 3 |
| 2025 | 2 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Temporary sheet bonding method and apparatus21 Apr 2026US 12,606,720 B2Corning Incorporated
- Method for fabricating an assembly for a card and a card comprising a metallized film, a microcircuit card and an assembly for said card31 Mar 2026US 12,589,583 B2Idemia France
- Panel for forming a floor covering15 Jul 2025US 12,359,446 B2Unilin BV
- Sheet processing apparatus, image forming apparatus, and image forming system1 Jul 2025US 12,343,969 B2Ricoh Company, Ltd.
- Method and device for adhesively bonding substrates in film form and composite body obtained thereby5 Nov 2024US 12,134,257 B2Henkel AG & Co. KGaA
- Methods and devices for mechanical separation of multilayer tapered interlayers12 Feb 2026US 2026/0042285 A1Solutia Inc.
- Lamination-forming system and method of manufacturing lamination-formed product22 Jan 2026US 2026/0021653 A1The Japan Steel Works, Ltd.
- Panel for forming a floor covering and method for manufacturing such panels9 Oct 2025US 2025/0314079 A1Unilin BV
- A method for manufacturing a paperboard based packaging laminate14 Aug 2025US 2025/0256494 A1Stora Enso OYJ
- Temporary sheet bonding method and apparatus23 Jan 2025US 2025/0026963 A1Corning Incorporated
Most cited
By later US patents
- Apparatus for applying heat bondable lamina to a substrate94US 5,783,024 ANBS Imaging Systems, Inc. · 1998
- Low pressure melamine/veneer panel and method of making the same90US 5,925,211 AInternational Paper Company · 1999
- Panel for forming a floor covering, method for manufacturing such panels and granulate applied herewith63US 9,758,973 B2Unilin, Bvba · 2017
- Method for applying heat bondable lamina to a substrate59US 6,007,660 APolaroid Corporation · 1999
- Process for the manufacture of an improved laminated material55US 6,537,407 B1Acordis Acetate Chemicals Limited · 2003