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US 12,134,257 B2Granted
Method and device for adhesively bonding substrates in film form and composite body obtained thereby
AssigneeHenkel AG & Co. KGaA
InventorsHans-Georg Kinzelmann, Michael Gierlings
Life of this patent
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Abstract
The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.
Claims15
A method for adhesively bonding a flexible film to a substrate, comprising:
- providing a flexible first substrate film having a first surface and an opposing second surface;
- providing a cooling roller having a cooling surface, the roller rotation defining a process direction;
- providing a heating element spaced from the cooling surface;
- moving the flexible film in a process direction;
- cooling the flexible film second surface by contact with the cooling roller surface while the flexible film it is moving in the process direction;
- heating the flexible film first surface to a softened state while the flexible film second surface is in contact with the cooling roller and the flexible film is moving in the process direction;
- providing a second substrate having a bonding surface;
- applying an adhesive to at least a portion of the second substrate bonding surface;
- disposing the flexible film heated first surface adjacent the adhesive and the second substrate bonding surface so that the adhesive is between the flexible film heated first surface and the second substrate bonding surface;
- and
- applying pressure using a press roller rotating in a direction counter to the cooling roller rotation to force the flexible film heated first surface into contact with the adhesive and the second substrate bonding surface;
- wherein the flexible film is initially only cooled and subsequently both cooled on the second surface and heated on the first surface as it moves in the process direction.
9 more elements
A method for adhesively bonding a flexible film to a substrate, comprising:
- providing a flexible first substrate film having a first surface and an opposing second surface;
- providing a cooling roller having a cooling surface, the roller rotation defining a process direction;
- providing a heating element spaced from the cooling surface;
- moving the flexible film in a process direction;
- cooling the flexible film second surface by contact with the cooling roller surface while the flexible film it is moving in the process direction;
- heating the flexible film first surface to a softened state while the flexible film second surface is in contact with the cooling roller and the flexible film is moving in the process direction;
- providing a second substrate having a bonding surface;
- applying an adhesive to at least a portion of the second substrate bonding surface;
- disposing the flexible film heated first surface adjacent the adhesive and the second substrate bonding surface so that the adhesive is between the flexible film heated first surface and the second substrate bonding surface;
- and
- applying pressure using a press roller rotating in a direction counter to the cooling roller rotation to force the flexible film heated first surface into contact with the adhesive and the second substrate bonding surface;
- wherein the heating element is positioned in proximity to the point at which the flexible film is disposed to the second substrate bonding surface so that the flexible film second surface is initially cooled without the flexible film first surface being heated.
9 more elements
Dependencies are inferred from the claim text.