Method for fabricating an assembly for a card and a card comprising a metallized film, a microcircuit card and an assembly for said card

Abstract

A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer having, on a surface, at least the dimensions of a microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure, and removing the first non-adhesive bearing liner. Also provided are a method for fabricating a microcircuit card and a microcircuit card obtained by this method.

Dependencies are inferred from the claim text.