B32B 2311/12
Copper
B32B2311/12 (Copper) appears on 537 US grants and 539 published applications in this corpus.
Search patents in B32B- Granted patents
- 537
- Published applications
- 539
- Assignees
- 418
- Inventors
- 1,627
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 7 | 0 |
| 1988 | 8 | 0 |
| 1989 | 7 | 0 |
| 1990 | 13 | 0 |
| 1991 | 14 | 0 |
| 1992 | 18 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 13 | 0 |
| 2001 | 15 | 2 |
| 2002 | 15 | 20 |
| 2003 | 22 | 33 |
| 2004 | 22 | 31 |
| 2005 | 22 | 25 |
| 2006 | 11 | 26 |
| 2007 | 13 | 15 |
| 2008 | 8 | 8 |
| 2009 | 12 | 18 |
| 2010 | 10 | 6 |
| 2011 | 9 | 6 |
| 2012 | 7 | 16 |
| 2013 | 8 | 2 |
| 2014 | 5 | 8 |
| 2015 | 2 | 23 |
| 2016 | 10 | 11 |
| 2017 | 12 | 28 |
| 2018 | 14 | 29 |
| 2019 | 13 | 26 |
| 2020 | 15 | 30 |
| 2021 | 22 | 25 |
| 2022 | 26 | 23 |
| 2023 | 15 | 27 |
| 2024 | 20 | 32 |
| 2025 | 19 | 32 |
| 2026 | 19 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-resin layered body and method for manufacturing metal-resin layered body6 Oct 2026US 12,752,515 B2Rimtec Corporation
- Cookware with copper bonded layer29 Sep 2026US 12,745,872 B2All-Clad Metalcrafters LLC
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Optically transparent glass frequency absorber25 Aug 2026US 12,715,197 B2Corning Incorporated
- Permeable materials capable of lightning strike protection and use thereof in resin infusion processing25 Aug 2026US 12,715,198 B2Cytec Industries Inc.
- Bidirectional actuator and method for manufacturing the same27 Aug 2026US 2026/0251129 A1Korea Advanced Institute of Science and Technology
- Laminated structure and method for manufacturing laminated structure13 Aug 2026US 2026/0233489 A1Tomoegawa Co., Ltd.
- Flame retardant and use thereof13 Aug 2026US 2026/0234171 A1Shikoku Chemicals Corporation
- Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same30 Jul 2026US 2026/0218021 A1Shin-Etsu Chemical Co., Ltd.
- Clad30 Jul 2026US 2026/0221312 A1NHK Spring Co., Ltd.
Most cited
By later US patents
- Method for manufacturing electrosurgical seal plates122US 8,112,871 B2Tyco Healthcare Group LP · 2012
- Amorphous metal laminate sheet102US 4,749,625 AHiraoka & Co., Ltd. · 1988
- Rigid flex printed circuit configuration86US 5,004,639 ASheldahl, Inc. · 1991
- Metallization process76US 4,215,170 AEurographics Holding, N. V. · 1980
- Process for treating copper surface74US 4,902,551 AHitachi Chemical Company, Ltd. · 1990