B32B 2264/1055
Copper or nickel
B32B2264/1055 (Copper or nickel) appears on 23 US grants and 47 published applications in this corpus.
Search patents in B32B- Granted patents
- 23
- Published applications
- 47
- Assignees
- 38
- Inventors
- 122
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 12 |
| 2022 | 2 | 7 |
| 2023 | 5 | 12 |
| 2024 | 3 | 8 |
| 2025 | 3 | 3 |
| 2026 | 9 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Encapsulation film22 Sep 2026US 12,741,448 B2LG Chem.Ltd.
- Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layer23 Jun 2026US 12,661,867 B2Mitsubishi Materials Corporation
- Non-passive anti-viral and nanofilter based respirators2 Jun 2026US 12,643,063 B1University of Louisville Research Foundation, Inc.
- Conductive composition for bonding, bonding structure using same, and manufacturing method thereof26 May 2026US 12,636,700 B2Mitsui Kinzoku Company, Limited
- Electronic device housing and electronic device including the same12 May 2026US 12,625,569 B2Samsung Electronics Co., Ltd.
- Sheet-shaped bonding material and method of producing same, and bonded body and method of producing same30 Apr 2026US 2026/0117096 A1Taiyo Nippon Sanso Corporation
- Deformable structures formed from metal nanoparticles and use thereof in heat transfer12 Mar 2026US 2026/0070312 A1
- Antipathogenic fibrous material15 Jan 2026US 2026/0013580 A1SINTX Technologies, Inc.
- Multilayer article comprising metal, thermally conductive hybrid, and thermally conductive continuous fiber composite17 Jul 2025US 2025/0229507 A1Avient Corporation
- Process for making a layered material comprising a micro- and/or nanostructured layer and adhesive sheet for use in said process19 Jun 2025US 2025/0196468 A1
Most cited
By later US patents