Conductive composition for bonding, bonding structure using same, and manufacturing method thereof

A conductive composition for bonding, comprising a copper powder and a carboxylic acid mixed therewith,

• wherein
• the carboxylic acid has a branched carbon chain in its structure,
• the copper powder comprises first copper particles and second copper particles, a percentage of the first copper particles being 30 to 95 mass % relative to a total mass of the first and second copper particles, wherein,
• the first copper particles have a volume-based cumulative particle size D50 of 0.11 μm or more and less than 1 μm at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 μm in a particle size distribution of the copper powder that is determined using a scanning electron microscope, and
• the second copper particles have a volume-based cumulative particle size D50 of 1 μm or more and 10 μm or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 μm or more in the particle size distribution of the copper powder that is determined using the scanning electron microscope, and
• the carboxylic acid is contained in an amount of 6 parts by mass or more and 24 parts by mass or less per 100 parts by mass of the copper powder.