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US 12,625,569 B2Granted
Electronic device housing and electronic device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunjung Jung, Hangyu Hwang, Hyeonseok Yoon, Hyoin Kim
Life of this patent
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Abstract
An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
Claims17
An electronic device housing, comprising:
- an instrument;
- a first primer layer provided to cover the instrument;
- a film layer provided on the first primer layer;
- a second primer layer provided on the film layer;
- and
- a coating layer provided on the second primer layer,
- wherein the film layer has at least one overwrap at which the film layer overlaps and is configured to surround the first primer layer.
4 more elements
An electronic device surrounded by an electronic device housing, wherein the electronic device housing comprising:
- an instrument;
- a first primer layer provided to surround the instrument;
- a film layer provided on the first primer layer;
- a second primer layer provided on the film layer;
- and
- a coating layer provided on the second primer layer,
- wherein the film layer has at least one overwrap at which the film layer overlaps and is configured to surround the first primer layer.
4 more elements
Dependencies are inferred from the claim text.