B32B 2037/1261
Moisture curable
Official title: {moisture curable}
B32B2037/1261 (Moisture curable) appears on 16 US grants and 30 published applications in this corpus.
Search patents in B32B- Granted patents
- 16
- Published applications
- 30
- Assignees
- 23
- Inventors
- 64
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 3 |
| 2020 | 2 | 2 |
| 2021 | 3 | 3 |
| 2022 | 0 | 3 |
| 2023 | 4 | 4 |
| 2024 | 1 | 2 |
| 2025 | 1 | 2 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for producing polyurethane sandwich molded parts17 Feb 2026US 12,552,111 B2BASF SE
- Method for preparation of a laminate article including a silicone pressure sensitive adhesive adhered to silicone rubber28 Oct 2025US 12,454,125 B2Dow Silicones Corporation
- Multi-layer wood composite block, multi-layer wood veneer, and method for the production thereof10 Sep 2024US 12,083,770 B2Fritz Kohl GmbH & Co. KG
- Method for adhesively bonding rubber-based thermoplastic substrates3 Oct 2023US 11,773,294 B2Sika Technology AG
- Method for the production of curved furniture components and component thus obtainable11 Jul 2023US 11,697,282 B2Technoform LLC
- Moisture cure solvent free laminating adhesive and laminates3 Sep 2026US 2026/0258288 A1Arkema France
- Adhesive structure and method for manufacturing adhesive structure5 Mar 2026US 2026/0061723 A1Subaru Corporation
- Resin composition, cured product, laminate, and method for producing laminate2 Oct 2025US 2025/0304736 A1Kuraray Co., Ltd.
- Method for preparation of a laminate article including a silicone pressure sensitive adhesive adhered to silicone rubber3 Apr 2025US 2025/0108592 A1Dow Silicones Corporation
- Adhesive bonding method for automated processes15 Feb 2024US 2024/0052204 A1Sika Technology AG
Most cited
By later US patents