Moisture cure solvent free laminating adhesive and laminates
AssigneeArkema France
InventorsByoungchul LEE, Jared STEED, Randy JOHNSON
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Abstract
The present disclosure relates to a SFLA composition comprising the reaction product of precursors, the precursors comprise (i) a crystallizable polyol having: (1) a melting point of at least about 30° C.; and (2) an OH number of at least about 10 mg KOH/g, and (ii) less than 10 wt % of a tackifier having a melting point or softening point of at least about 40° C. A viscosity of the adhesive comprises at least one of: (1) less than about 10,000 cP at 60° C., (2) less than about 5,000 cP at 75° C. and (3) combinations thereof. Applications for the SFLA include the making of flexible packaging, wall coverings and other uses that include the lamination or bonding of one or more porous substrates.
Claims13
A moisture cure solvent free laminating adhesive composition comprising a reaction product of precursors, the precursors comprise:
- a. a crystallizable polyol having:
- i. (1) a melting point of at least about 30° C.;
- and
- ii. (2) a OH number of at least about 10 mg KOH/g
- iii. preferably the crystallizable polyol may comprise at least 5 wt % up to 50 wt % of the total weight of the composition;
- b. less than 10 wt % of a tackifier having a melting point or softening point of at least about 40° C., preferably at least about 50° C., more preferably at least about 65° C. and even more preferred no more than about 100° C., the weight percentage of the tackifier based on the total weight of the composition;
- c. non-crystallizable polyol having a number average molecular weight of at least about 400 Daltons,
- d. an isocyanate containing compound comprises a 4,4′ MDI compound, wherein a viscosity of the adhesive comprises at least one of:
- 1. less than about 10,000 cP at 60° C.,
- 2. less than about 5,000 cP, preferably less than about 4000 cP, at 75° C. and
- 3. combinations thereof.
Dependencies are inferred from the claim text.