Method for adhesively bonding rubber-based thermoplastic substrates

Use of Two substrates S adhesively bonded by curing a moisture-curable adhesive composition A comprising:

• at least one polymer P containing silane groups,
• between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL,
• between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1,
• between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3-C20-alkyl-functional alkoxysilane AS2,
• wherein at least one of the substrates S is a substrate S1, the substrate S1 comprising:
• at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of:
• between 15 and 99 wt.-% of at least one thermoplastic polymer E1,
• between 1 and 85 wt.-% of at least one elastomer E2, the proportions being based on the total weight of mixture E.

A kit-of-parts comprising:

• i) a moisture-curable adhesive composition A comprising:
• at least one polymer P containing silane groups,
• between 10 and 40 wt.-%, based on the total composition, of at least one polymeric plasticizer PL,
• between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric amino-functional alkoxysilane AS1;
• between 0.1 and 5 wt.-%, based on the total composition, of at least one monomeric or oligomeric C3-C20-alkyl-functional alkoxysilane AS2;
• and
• ii) at least two substrates S, wherein at least one of the substrates S is a substrate S1, said substrate S1 comprising:
• at least 40 wt.-%, based on the total weight of substrate S1, of a mixture E, said mixture E consisting of:
• between 15 and 99 wt.-% of at least one thermoplastic polymer E1,
• between 1 and 85 wt.-% of at least one elastomer E2;
• said proportions being based on the total weight of mixture E.