B32B 15/20
Comprising aluminium or copper
Official title: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
B32B15/20 (Comprising aluminium or copper) appears on 4,704 US grants and 6,752 published applications in this corpus.
Search patents in B32B- Granted patents
- 4,704
- Published applications
- 6,752
- Assignees
- 2,674
- Inventors
- 14,091
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 25 | 0 |
| 1977 | 26 | 0 |
| 1978 | 27 | 0 |
| 1979 | 15 | 0 |
| 1980 | 19 | 0 |
| 1981 | 33 | 0 |
| 1982 | 26 | 0 |
| 1983 | 12 | 0 |
| 1984 | 33 | 0 |
| 1985 | 38 | 0 |
| 1986 | 28 | 0 |
| 1987 | 36 | 0 |
| 1988 | 39 | 0 |
| 1989 | 36 | 0 |
| 1990 | 42 | 0 |
| 1991 | 22 | 0 |
| 1992 | 32 | 0 |
| 1993 | 22 | 0 |
| 1994 | 30 | 0 |
| 1995 | 28 | 0 |
| 1996 | 46 | 0 |
| 1997 | 20 | 0 |
| 1998 | 34 | 0 |
| 1999 | 23 | 0 |
| 2000 | 30 | 0 |
| 2001 | 28 | 6 |
| 2002 | 26 | 39 |
| 2003 | 26 | 39 |
| 2004 | 34 | 74 |
| 2005 | 18 | 84 |
| 2006 | 24 | 126 |
| 2007 | 29 | 108 |
| 2008 | 22 | 72 |
| 2009 | 24 | 148 |
| 2010 | 56 | 207 |
| 2011 | 63 | 200 |
| 2012 | 87 | 191 |
| 2013 | 104 | 150 |
| 2014 | 117 | 222 |
| 2015 | 105 | 250 |
| 2016 | 136 | 311 |
| 2017 | 177 | 447 |
| 2018 | 220 | 530 |
| 2019 | 324 | 526 |
| 2020 | 389 | 545 |
| 2021 | 359 | 629 |
| 2022 | 343 | 465 |
| 2023 | 370 | 446 |
| 2024 | 398 | 415 |
| 2025 | 303 | 320 |
| 2026 | 200 | 202 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Stiffening structure and method for stiffening a sheet element6 Oct 2026US 12,752,509 B2Photon, Inc.
- Metal-resin layered body and method for manufacturing metal-resin layered body6 Oct 2026US 12,752,515 B2Rimtec Corporation
- Pre-mold direct bond copper (DBC) substrate and manufacturing method thereof29 Sep 2026US 12,746,736 B2Tong Hsing Electronic Industries, Ltd.
- Laminate29 Sep 2026US 12,746,738 B2Toyobo Co., Ltd.
- Metal thin film substrate, transparent display comprising same, method for patterning metal thin film substrate, and method for manufacturing transparent display22 Sep 2026US 12,741,445 B2Dongwoo Fine-Chem Co., Ltd.
- Process for the preparation of a bonded structure, a bonded structure and use of said bonded structure for preparing an automotive part8 Oct 2026US 2026/0307381 A1Sabic Global Technologies B.V.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Sandwich panel structure and method of manufacturing sandwich panel structure1 Oct 2026US 2026/0295972 A1Mitsubishi Electric Corporation
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Ceramic circuit board and manufacturing method therefor1 Oct 2026US 2026/0304591 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Patterned metal foil laminate and method for making same274US 5,800,724 AFort James Corporation · 1998
- Fire-resistant intumescent laminates251US 3,934,066 AW. R. Grace & Co. · 1976
- Method for forming laminate for microwave oven package184US 5,221,419 ABeckett Industries Inc. · 1993
- Microwave oven package178US 5,213,902 ABeckett Industries Inc. · 1993
- Tufted laminate web158US 7,410,683 B2The Procter & Gamble Company · 2008