Laminate
AssigneeToyobo Co., Ltd.
InventorsKaya Tokuda, Tetsuo Okuyama, Keisuke Matsuo
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AssigneeToyobo Co., Ltd.
InventorsKaya Tokuda, Tetsuo Okuyama, Keisuke Matsuo
Estimating the term…
Provided is a laminate that has excellent long-term heat resistance even when an inorganic substrate having a high surface roughness is used. This laminate is characterized by having an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, and satisfying the following (A)-(C). (A) The peel strength F0 of the laminate, as measured by a 90° peeling method, is 1.0-20 N/cm. (B) In the surface of the inorganic substrate after peeling the heat-resistant polymer film from the laminate at 90°, the area of a peeled portion on the boundary surface between the inorganic substrate and the silane coupling agent layer is at most 20% of the entire peeled surface. (C) The peel strength F1 of the laminate, as measured by the 90° peeling method after heating in a nitrogen atmosphere at 350° C. for 500 hours, is greater than F0.
A laminate comprising an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, wherein the inorganic substrate does not include copper, wherein the heat-resistant polymer film is a polyimide film obtained by causing a dehydration ring-closure reaction of a polyamic acid which is obtained by a reaction between a diamine and a tetracarboxylic acid, and wherein the following (A) to (E) are satisfied:
A method for manufacturing a laminate including an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, the method comprising:
Dependencies are inferred from the claim text.