Method for forming laminate for microwave oven package
AssigneeBeckett Industries Inc.
InventorD. Gregory Beckett
Life of this patent
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Abstract
A laminate structure useful for incorporating into a package structure for the microwave cooking of foodstuffs for consumption comprises an outer layer polymeric material, an outer layer of microwave transparent material, a grid layer having an electroconductive surface surrounding transmissive apertures located between the outer layers, and a thin layer of electroconductive material of sufficient thickness so that a portion of incident microwave energy is converted to thermal energy also located between the outer layers. The structure is useful in providing controlled surface heating and microwave transmittance to achieve a more uniformly heated product employing less structural material than the prior art.
Claims8
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises:
- forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a polymeric film layer,
- directly depositing a thin layer of electroconductive material over said grid layer to adhere to said electroconductive surface and to said polymeric film layer in said apertures, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and
- adhering said thin electroconductive material layer to a substrate layer of microwave transparent material.
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises:
- forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a thin layer of electroconductive material supported on a polymeric film layer, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and
- adhering said grid layer to a substrate layer of microwave transparent material.
Dependencies are inferred from the claim text.