Pre-mold direct bond copper (DBC) substrate and manufacturing method thereof

A pre-mold direct bond copper (DBC) substrate, comprising:

• a ceramic board having a first surface, a second surface opposite to the first surface, and a surrounding lateral surface that is connected to the first surface and the second surface;
• a first copper layer eutectic-bonded to the first surface, wherein the first copper layer has a bonding surface arranged away from the first surface, and a part of the first surface not in contact with the first copper layer is defined as a layout region;
• and
• a pre-encapsulation layer formed on the layout region in a molding manner to cover the first copper layer, wherein at least part of the bonding surface of the first copper layer is exposed from the pre-encapsulation layer, and wherein a coefficient of thermal expansion (CTE) of the pre-encapsulation layer is between a CTE of the ceramic board and a CTE of the first copper layer;
• wherein the pre-encapsulation layer has a top side and a surrounding lateral side that is connected to the top side, and wherein the top side of the pre-encapsulation layer is higher than or coplanar with the bonding surface of the first copper layer relative to the first surface, and the surrounding lateral side of the pre-encapsulation layer is flush with the surrounding lateral surface of the ceramic board.