B29K 2507/045
Diamond
Official title: {Diamond}
B29K2507/045 (Diamond) appears on 6 US grants and 12 published applications in this corpus.
Search patents in B29K- Granted patents
- 6
- Published applications
- 12
- Assignees
- 11
- Inventors
- 23
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 3 |
| 2020 | 1 | 2 |
| 2021 | 2 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for preparing flexible sol-gel polishing block14 Apr 2026US 12,600,011 B2Huaqiao University
- Three-dimensional printing with polyamides and cubic lattice structured particles28 Oct 2025US 12,454,097 B2Peridot Print LLC
- Method of making pen body resin rods11 Jun 2024US 12,005,614 B2
- Conductive diamond application system3 Aug 2021US 11,077,654 B2Global Circuit Innovations Inc.
- Flexible sensors incorporating piezoresistive composite materials and fabrication methods16 Mar 2021US 10,948,366 B2Arizona Board of Regents on behalf of Arizona State University
- Three-dimensional printing with polyamides and cubic lattice structured particles19 Feb 2026US 2026/0048544 A1Peridot Print LLC
- Three-dimensional printing with polyamides and cubic lattice structured particles22 Aug 2024US 2024/0278488 A1Hewlett-Packard Development Company, L. P.
- Method for preparing flexible sol-gel polishing block29 Jun 2023US 2023/0202000 A1Huaqiao University
- A Filament and a 3D Printed Item10 Jun 2021US 2021/0170671 A1Carbodeon Ltd Oy
- Conductive Diamond Application System23 Jul 2020US 2020/0230940 A1Global Circuit Innovations Inc.
Most cited
By later US patents