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US 11,077,654 B2Granted
Conductive diamond application system
AssigneeGlobal Circuit Innovations Inc.
InventorErick Merle Spory
Life of this patent
Estimating the term…
Abstract
A system is provided. The system includes a 3D printer, which includes a first dispenser and a second dispenser. The first dispenser is configured to apply conductive material to a surface, and the second dispenser is configured to apply conductive diamonds to a surface. The conductive material includes a mixture of an elastomer and at least one of nickel and silver, and the conductive diamonds are between 1 and 10 microns in size.
Claims10
A system, comprising:
- a 3D printer, comprising:
- a first dispenser, configured to apply conductive material to a surface;
- a second dispenser, configured to apply conductive diamonds to a surface;
- the conductive material comprising a mixture of an elastomer and at least one of nickel and silver;
- and
- the conductive diamonds between 1 and 10 microns in size.
3 more elements
Dependencies are inferred from the claim text.