Conductive diamond application method
AssigneeGlobal Circuit Innovations Inc.
InventorErick Merle Spory
Life of this patent
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Abstract
A method is provided. The method includes preparing a surface to receive a 3D printed layer, 3D printing a conductive layer comprising a plurality of overlaid layers of conductive material to the surface, and 3D printing conductive diamonds to the conductive layer. Preparing the surface includes one or more of texturing the surface and chemically treating the surface. The texturing is performed in order to not adversely impact regularity of the surface and limit variations in the height from the surface of conductive diamonds. Chemically treating the surface reduces films or coatings that may impact adhesion between the surface and the conductive layer, without degrading the conductive layer.
Claims10
A method, comprising:
- preparing a surface to receive a 3D printed layer, comprising one or more of:
- texturing the surface, the texturing performed in order to not adversely impact regularity of the surface and limit variations in height from surface of conductive diamonds;
- and
- chemically treating the surface to reduce films or coatings that may impact adhesion between the surface and a conductive layer, without degrading the conductive layer;
- 3D printing, by a 3D printer, the conductive layer comprising a plurality of overlaid layers of conductive material to the surface;
- and
- 3D printing, by the 3D printer, the conductive diamonds to the conductive layer.
Dependencies are inferred from the claim text.