B29C 66/452
The article having a disc form
Official title: {the article having a disc form, e.g. making CDs or DVDs}
B29C66/452 (The article having a disc form) appears on 234 US grants and 152 published applications in this corpus.
Search patents in B29C- Granted patents
- 234
- Published applications
- 152
- Assignees
- 109
- Inventors
- 368
- Latest grant
- 11 Jul 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 10 | 0 |
| 1999 | 22 | 0 |
| 2000 | 19 | 0 |
| 2001 | 24 | 12 |
| 2002 | 22 | 20 |
| 2003 | 14 | 17 |
| 2004 | 20 | 25 |
| 2005 | 8 | 17 |
| 2006 | 17 | 9 |
| 2007 | 4 | 9 |
| 2008 | 5 | 9 |
| 2009 | 5 | 9 |
| 2010 | 4 | 6 |
| 2011 | 5 | 4 |
| 2012 | 2 | 4 |
| 2013 | 3 | 1 |
| 2014 | 2 | 0 |
| 2015 | 2 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 5 |
| 2020 | 0 | 1 |
| 2021 | 6 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Device and method for bonding substrates11 Jul 2023US 11,697,281 B2EV Group E. Thallner GmbH
- Device and method for bonding substrates13 Jul 2021US 11,059,280 B2EV Group E. Thallner GmbH
- Device and method for bonding substrates1 Jun 2021US 11,020,950 B2EV Group E. Thallner GmbH
- Device and method for bonding substrates1 Jun 2021US 11,020,951 B2EV Group E. Thallner GmbH
- Device and method for bonding substrates1 Jun 2021US 11,020,952 B2EV Group E. Thallner GmbH
- Device and method for bonding substrates21 Sep 2023US 2023/0294390 A1EV Group E. Thallner GmbH
- Device and method for bonding substrates23 Sep 2021US 2021/0291504 A1EV Group E. Thallner GmbH
- Alternative joining method13 May 2021US 2021/0138738 A1Sgl Carbon SE
- Wafer bonding apparatus and wafer bonding system using the same9 Jan 2020US 2020/0013643 A1Samsung Electronics Co., Ltd.
- Device and method for bonding substrates18 Jul 2019US 2019/0217594 A1EV Group E. Thallner GmbH
Most cited
By later US patents
- Method of mass producing and packaging integrated optical subsystems74US 6,235,141 B1Digital Optics Corporation · 2001
- Optical recording medium having two separate recording layers68US 5,764,619 AMatsushita Electric Industrial Co., Ltd. · 1998
- Information recording medium, method for manufacturing the medium, and apparatus for manufacturing the medium68US 6,083,598 AKabushiki Kaisha Toshiba · 2000
- Lamination of composite eyeglass lenses56US 5,433,810 A1995
- Method and clamping device for bonding thin lens wafers50US 4,927,480 ASignet Armorlite, Inc. · 1990