Wafer bonding apparatus and wafer bonding system using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJun-hyung KIM, Sung-hyup KIM, Tae-yeong KIM
Life of this patent
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Abstract
A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.
Claims25
A wafer bonding apparatus, comprising:
- a first bonding chuck to fix a first wafer arranged on a first surface thereof;
- a second bonding chuck to fix a second wafer on a second surface thereof, the second surface facing the first surface;
- a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface;
- and
- a membrane member having a protrusion protruding from a center portion of the second surface towards the first surface and a planar portion defining the protrusion in an outer region surrounding the center portion of the second surface.
A wafer bonding apparatus, comprising:
- a first bonding chuck to fix a first wafer arranged on a first surface thereof,
- a second bonding chuck to fix a second wafer on a second surface thereof, the second surface facing the first surface;
- a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface;
- and
- an aperture stop serving as the second surface of the second bonding chuck, and
- a membrane member having a protrusion protruding from a center portion of the second surface towards the first surface the protrusion protrudes from an opening portion of the aperture stop in a direction towards the first surface and a planar portion in a closed portion of the aperture stop.
A wafer bonding system, comprising:
- a first bonding chuck to fix a first wafer arranged on a first surface thereof;
- a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface;
- a bonding initiation member at a center of the first bonding chuck to push the first wafer in a direction towards the second surface;
- a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion of the second surface;
- a sensor spaced apart from the first bonding chuck and the second bonding chuck to measure a bonding propagation distance of the first wafer;
- and
- a controller to control a shape of the membrane member according to the bonding propagation distance.
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Dependencies are inferred from the claim text.