B29C 45/462
Injection of preformed charges of material
Official title: {Injection of preformed charges of material}
B29C45/462 (Injection of preformed charges of material) appears on 50 US grants and 20 published applications in this corpus.
Search patents in B29C- Granted patents
- 50
- Published applications
- 20
- Assignees
- 37
- Inventors
- 111
- Latest grant
- 19 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 10 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 6 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 2 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 1 |
| 2016 | 2 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Resin supply systems19 Apr 2022US 11,305,471 B2Coexpair
- Manufacturing method of liquid supply component25 May 2021US 11,014,361 B2Canon Kabushiki Kaisha
- Injection molding apparatus29 Nov 2016US 9,505,155 B2Satoseiki Co., Ltd.
- Resin-transfer-moulding method31 May 2016US 9,352,517 B2Airbus Deutschland GmbH
- Non-homogeneous molding of packaged semiconductor devices1 Dec 2015US 9,202,770 B1Freescale Semiconductor, Inc.
- Method for Encapsulating or Embedding Components by Resin Transfer Molding, Electrical Machine, and Resin Transfer Molding Device1 Feb 2024US 2024/0039379 A1Bayerische Motoren Werke Aktiengesellschaft
- Manufacturing method and manufacturing apparatus of liquid supply component, and liquid ejection head22 Aug 2019US 2019/0255853 A1Canon Kabushiki Kaisha
- Resin supply systems23 May 2019US 2019/0152111 A1Coexpair
- Injection molding apparatus19 Feb 2015US 2015/0050382 A1Satoseiki Co., Ltd.
- Materials and processes for bonding acoustically neutral structures for use in ultrasound catheters25 Apr 2013US 2013/0098541 A1General Electric Company
Most cited
By later US patents
- Method of resin molding and resin molding machine for the same66US 5,824,252 AApic Yamada Corporation · 1998
- Method of molding resin for sealing an electronic device49US 5,435,953 ATowa Corporation · 1995
- Method for packaging microelectronic substrates44US 6,558,600 B1Micron Technology, Inc. · 2003
- Dambarless leadframe for molded component encapsulation36US 5,891,377 ATexas Instruments Incorporated · 1999
- Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component35US 5,098,626 A1992