Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component
OwnerIreneus J. T. M. Pasinventor
Life of this patent
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Abstract
Method for packing a measured quantity of thermosetting resin, intended for encapsulating a component such as an integrated circuit by introducing this quantity into a flexible plastics covering which can be sealed airtight, and packing for a measured quantity of thermosetting resin intended for encapsulating a component.
Claims4
Method for packing a measured quantity of thermosetting plastic for use in encapsulating an integrated circuit component, comprising introducing a plurality of measured quantities of thermosetting plastic supplied continuously from an extruder into a flexible plastic covering of indeterminate length and forming the length of flexible plastic into a thin-walled flexible tube including the thermosetting resin which is formed into a plurality of similar discreet units of resin in a strip, flat rolling the tube to a predetermined thickness to form opposite walls, bringing the opposite walls of the tube together to form edge boundaries which are transverse to the longitudinal edges of the tube, forming a bulge in an edge boundary to define an out-flow spout and directed toward the next edge boundary, sealing the plastic cover airtight around each of said units, and separating the sealed units from the strip prior to an encapsulating step.
Method for operating a casting mould for encapsulating an integrated circuit component with a thermosetting resin comprising supplying continuously the resin from an extruder into a thin-walled flexible plastic tube while excluding air therefrom, sealing the tube airtight, flat-rolling the tube to a predetermined thickness to form opposite walls, bringing the opposite walls of the tube together at predetermined distances such that there is a predetermined quantity of resin between two successive distances, bringing the opposite walls of the tube together to form edge boundaries which are transverse to the longitudinal edges of the tube, forming a bulge in the edge boundary to define an out-flow spout and directed toward the next edge boundary, positioning an individual sealed unit with its out-flow spout sealingly in an injection channel connected to a cavity of a mould, and exerting pressure on the remaining portion of the unit to empty the resin from the unit into the mould cavity.
Dependencies are inferred from the claim text.