Non-homogeneous molding of packaged semiconductor devices
AssigneeFreescale Semiconductor, Inc.
InventorsChee Seng Foong, Lan Chu Tan
Life of this patent
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Abstract
A packaged semiconductor device has an integrated circuit (IC) die and first and second volumes of molding compound. The first volume of molding compound is disposed on a first portion of a first side of the IC die and comprises a first molding compound. The second volume of molding compound is disposed on a second side of the IC die, different from the first side, and comprises a second molding compound, different from the first molding compound. By including different molding compounds, the properties of the packaged semiconductor device can be varied across the device.
Claims9
A method for assembling a packaged semiconductor device, the method comprising:
- (a) positioning a partially-assembled packaged semiconductor device comprising an integrated circuit (IC) die within a mold cavity;
- (b) positioning a molding compound pellet within a pot, wherein the molding compound pellet comprises a first molding compound and a second molding compound different from the first molding compound;
- (c) pushing the second molding compound into a second volume of the mold cavity disposed on a second side of the IC die;
- and
- (d) pushing the first molding compound into a first volume of the mold cavity disposed on at least a first portion of a first side of the IC die, different from the second side, and
- after step (c) and before step (d), pushing a mixture of the first and second molding compounds from the first and second regions into a third volume of the mold cavity,
- wherein the molding compound pellet comprises (i) a first region comprising the first molding compound and (ii) a second region comprising the second molding compound and a recess, wherein the first region is located within the recess of the second region.
Dependencies are inferred from the claim text.