B29C 45/2669
With means for removing excess material
Official title: {with means for removing excess material, e.g. with overflow cavities (B29C45/1711 takes precedence)}
B29C45/2669 (With means for removing excess material) appears on 107 US grants and 103 published applications in this corpus.
Search patents in B29C- Granted patents
- 107
- Published applications
- 103
- Assignees
- 113
- Inventors
- 293
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 2 |
| 2002 | 2 | 4 |
| 2003 | 5 | 3 |
| 2004 | 1 | 3 |
| 2005 | 1 | 2 |
| 2006 | 0 | 5 |
| 2007 | 3 | 1 |
| 2008 | 1 | 2 |
| 2009 | 0 | 4 |
| 2010 | 2 | 4 |
| 2011 | 0 | 4 |
| 2012 | 5 | 4 |
| 2013 | 1 | 10 |
| 2014 | 8 | 4 |
| 2015 | 1 | 2 |
| 2016 | 6 | 2 |
| 2017 | 3 | 6 |
| 2018 | 4 | 3 |
| 2019 | 1 | 4 |
| 2020 | 1 | 4 |
| 2021 | 5 | 3 |
| 2022 | 5 | 6 |
| 2023 | 5 | 5 |
| 2024 | 1 | 7 |
| 2025 | 6 | 5 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin molding process28 Jul 2026US 12,691,614 B2Pratt & Whitney Canada Corp.
- Injection mold and method for manufacturing injection-molded parts5 May 2026US 12,617,133 B2WAGO Verwaltungsgesellschaft mbH
- Container and method of manufacturing same23 Sep 2025US 12,420,556 B2Canon Kabushiki Kaisha
- Component with moulded-on seal5 Aug 2025US 12,378,956 B2Valeo Powertrain GmbH
- Tubing coupler moldings and systems, and associated methods1 Jul 2025US 12,343,912 B2Repligen Corporation
- Cable with molded body and method for manufacturing cable with molded body17 Sep 2026US 2026/0273820 A1Proterial, Ltd.
- Method for forming pfa coated butterfly plate without flow marks18 Jun 2026US 2026/0166790 A1Nanjing Comptech Composites Corp.
- Mould for a sleeve of a wiring harness23 Apr 2026US 2026/0109091 A1Airbus Operations GmbH
- Wing assembly comprising a wiring harness23 Apr 2026US 2026/0109475 A1Airbus Operations GmbH
- Molding method11 Dec 2025US 2025/0375927 A1Kokoku Intech Co., Ltd.
Most cited
By later US patents
- Method for making tamper-preventing, contact-type, smart cards276US 6,241,153 B1CardXX, Inc. · 2001
- Encapsulation molding equipment195US 5,484,274 ANeu Dynamics Corp. · 1996
- Apparatus and method for injection molding lenses87US 4,540,534 AAmerican Optical Corporation · 1985
- Method of molding a microneedle78US 8,088,321 B23M Innovative Properties Company · 2012
- Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling73US 5,578,261 ALucent Technologies Inc. · 1996