B29C 33/68
Release sheets
B29C33/68 (Release sheets) appears on 318 US grants and 335 published applications in this corpus.
Search patents in B29C- Granted patents
- 318
- Published applications
- 335
- Assignees
- 268
- Inventors
- 924
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 12 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 14 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 2 |
| 2002 | 6 | 14 |
| 2003 | 9 | 10 |
| 2004 | 5 | 8 |
| 2005 | 4 | 10 |
| 2006 | 3 | 13 |
| 2007 | 5 | 11 |
| 2008 | 6 | 12 |
| 2009 | 2 | 14 |
| 2010 | 7 | 10 |
| 2011 | 7 | 21 |
| 2012 | 11 | 16 |
| 2013 | 6 | 13 |
| 2014 | 9 | 11 |
| 2015 | 8 | 13 |
| 2016 | 7 | 24 |
| 2017 | 4 | 16 |
| 2018 | 11 | 9 |
| 2019 | 13 | 18 |
| 2020 | 12 | 10 |
| 2021 | 9 | 12 |
| 2022 | 9 | 23 |
| 2023 | 6 | 10 |
| 2024 | 11 | 10 |
| 2025 | 12 | 15 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mold release film11 Aug 2026US 12,703,126 B2Sumitomo Bakelite Co., Ltd.
- Embossed release film, vacuum bagging system, and methods of fabricating composite parts using the same14 Jul 2026US 12,679,006 B2Airtech International, Inc.
- Semiconductor chip molding die device16 Jun 2026US 12,660,551 B2Samsung Electronics Co., Ltd.
- Molded object26 May 2026US 12,638,927 B2Chance Line Industrial Co., Ltd.
- Release film and method for manufacturing release film5 May 2026US 12,617,128 B2Kobayashi & Co., Ltd.
- Release film for molding and chip packaging method6 Aug 2026US 2026/0231811 A1Nan Ya Plastics Corporation
- Mold release film30 Jul 2026US 2026/0216928 A1Sumitomo Bakelite Co., Ltd.
- Composite release films, and devices and methods using composite release film in field of additive manufacturing16 Jul 2026US 2026/0200143 A1Luxcreo (Beijing) Inc.
- Release film and method of producing semiconductor package2 Jul 2026US 2026/0183992 A1Resonac Corporation
- Method for recycling release sheet21 May 2026US 2026/0138310 A1NEION Film Coatings Corp.
Most cited
By later US patents
- Apparatus and method for the non-destructive separation of hardened material layers from a flat construction plane319US 7,438,846 B2Envisiontec GmbH · 2008
- Apparatus and method for the non-destructive separation of hardened material layers from a flat construction plane166US 7,195,472 B2Envisiontec GmbH · 2007
- Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape144US 7,964,267 B1BAE Systems Tensylon H.P.M., Inc. · 2011
- Breather material and method of coating fabric with silicone rubber142US 4,548,859 AThe Boeing Company · 1985
- Process of manufacturing ultrahigh molecular weight linear polyethylene shaped articles109US 5,037,928 AE. I. Du Pont de Nemours and Company · 1991