Release film and method of producing semiconductor package
AssigneeResonac Corporation
InventorsKoji NAKAMURA, Ryo TAMURA, Satoshi YABUSHITA, Tetsuya TANIGUCHI, Kazunori SAKUMA
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AssigneeResonac Corporation
InventorsKoji NAKAMURA, Ryo TAMURA, Satoshi YABUSHITA, Tetsuya TANIGUCHI, Kazunori SAKUMA
Estimating the term…
A release film includes a release layer and a substrate layer, the release layer includes two or more polymers, and satisfies at least one of the following (1) to (4). (1) The release layer has a plurality of different regions with different component ratios, and in a case in which Raman spectroscopy is performed on the different regions, at least a part of the different regions exhibits different peak intensities. (2) A surface of the release layer has a convex portion and a concave portion, and in a case in which Raman spectroscopy is performed on the convex portion and the concave portion, at least a part of the convex portion and at least a part of the concave portion exhibits different peak intensities. (3) A difference in SP value between at least two of the polymers is 0.3 or more. (4) At least one of the polymers is a nitrile group-containing (meth)acrylic polymer.
A release film comprising a release layer and a substrate layer, wherein:
A release film comprising a release layer and a substrate layer, wherein:
A release film comprising a release layer and a substrate layer, wherein:
Dependencies are inferred from the claim text.