Semiconductor chip molding die device

A die device for molding a plurality of semiconductor chips, the die device comprising:

• a lower die comprising a moving plate that has a plurality of V-groove structures configured to suction a release film coated with resin;
• and
• an upper die configured to descend to the lower die or ascend from the lower die so as to close/open the dies,
• wherein the upper die comprises at least a plurality of suction vent units configured to suction a substrate on which the semiconductor chips are arranged,
• wherein the lower die comprises an adjustment device configured to manually adjust tension of a spring supporting the moving plate,
• wherein the adjustment device comprises:
• a central shaft, and
• a non-rotating lift plate engaged with a rotation plate, disposed between the rotation plate and the spring,
• wherein the rotation plate is configured to be manually rotatable around the central shaft and further configured to actuate the non-rotating lift plate to cause the non-rotating lift plate to ascend or descend along the central shaft by rotation of the rotation plate around the central shaft, and
• wherein the tension of the spring is adjusted as the non-rotating lift plate ascends or descends.