B29C 33/12
Moulds or cores: with incorporated means for positioning inserts
Official title: with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)}
B29C33/12 (Moulds or cores: with incorporated means for positioning inserts) appears on 813 US grants and 554 published applications in this corpus.
Search patents in B29C- Granted patents
- 813
- Published applications
- 554
- Assignees
- 509
- Inventors
- 1,575
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 11 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 22 | 0 |
| 1985 | 14 | 0 |
| 1986 | 15 | 0 |
| 1987 | 13 | 0 |
| 1988 | 24 | 0 |
| 1989 | 29 | 0 |
| 1990 | 18 | 0 |
| 1991 | 19 | 0 |
| 1992 | 18 | 0 |
| 1993 | 18 | 0 |
| 1994 | 15 | 0 |
| 1995 | 12 | 0 |
| 1996 | 13 | 0 |
| 1997 | 25 | 0 |
| 1998 | 36 | 0 |
| 1999 | 24 | 0 |
| 2000 | 21 | 0 |
| 2001 | 16 | 6 |
| 2002 | 15 | 9 |
| 2003 | 10 | 11 |
| 2004 | 8 | 14 |
| 2005 | 4 | 14 |
| 2006 | 11 | 10 |
| 2007 | 2 | 6 |
| 2008 | 3 | 19 |
| 2009 | 8 | 11 |
| 2010 | 13 | 18 |
| 2011 | 11 | 13 |
| 2012 | 7 | 11 |
| 2013 | 11 | 25 |
| 2014 | 11 | 20 |
| 2015 | 25 | 26 |
| 2016 | 19 | 20 |
| 2017 | 14 | 35 |
| 2018 | 22 | 34 |
| 2019 | 27 | 51 |
| 2020 | 35 | 29 |
| 2021 | 31 | 31 |
| 2022 | 35 | 44 |
| 2023 | 27 | 29 |
| 2024 | 33 | 36 |
| 2025 | 23 | 17 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Molding die, method for manufacturing molding die, and method for manufacturing molded product15 Sep 2026US 12,734,731 B2Kasai Kogyo Co., Ltd.
- Pressure sensing system and seat cushion having the pressure sensing system25 Aug 2026US 12,715,392 B2Magna Seating Inc.
- Method and injection mould for producing a product from an insert and plastic body injection-moulded thereon16 Jun 2026US 12,654,370 B2FOSTAG Formenbau AG
- Semiconductor chip molding die device16 Jun 2026US 12,660,551 B2Samsung Electronics Co., Ltd.
- Device and method for producing spacers2 Jun 2026US 12,642,660 B2Heraeus Medical GmbH
- Method of producing sealing material and sealing material27 Aug 2026US 2026/0249570 A1Valqua, Ltd.
- Method for manufacturing insert molded article, mold for insert molding, and insert molded article20 Aug 2026US 2026/0241650 A1Yazaki Corporation
- Fabrication molds and fabrication methods for ultra-high performance concrete-normal concrete (uhpc-nc) specimens13 Aug 2026US 2026/0232408 A1South China University of Technology
- Method for producing a multilayer object and device13 Aug 2026US 2026/0233439 A1Aisapack Holding S.A.
- Solid-cryogen encapsulation system13 Aug 2026US 2026/0235349 A1The United States of America as represented by the Secretary of the Navy
Most cited
By later US patents
- Golf club head and process for its fabrication318US 4,988,104 AKunimori Kagaku Co., Ltd. · 1991
- Molding apparatus with retractable preform support pins242US 4,470,786 AOmron Tateisi Electronics Co. · 1984
- Methods for manufacturing three-dimensional devices and devices created thereby171US 7,410,606 B22008
- Sliding refrigerator shelf assembly153US 5,735,589 ADonnelly Technology, Inc. · 1998
- Potting of tubular bundles in housing125US 6,113,782 ATerumo Cardiovascular Systems Corporation · 2000